磁控溅射-电镀增厚Nb-Cu复合材料的界面结合性能

doi:10.13251/j.issn.0254-6051.2025.06.044

金属热处理 ›› 2025, Vol. 50 ›› Issue (6): 289-293.DOI: 10.13251/j.issn.0254-6051.2025.06.044

磁控溅射-电镀增厚Nb-Cu复合材料的界面结合性能

齐铭¹, 孙昱艳², 王鹏飞³, 方元¹, 安震¹, 丁旭¹

1.西安航空学院材料工程学院, 陕西西安 710077;
2.西安建筑科技大学材料科学与工程学院, 陕西西安 710055;
3.西北有色金属研究院, 陕西西安 710016

收稿日期:2024-12-11 修回日期:2025-03-21 出版日期:2025-06-25 发布日期:2025-07-08
通讯作者: 王鹏飞,教授级高工,博士,E-mail: 46816913@qq.com
作者简介:齐铭(1983—),男,讲师,博士,主要研究方向为金属材料、超导材料,E-mail: 93771617@qq.com。
基金资助:
西安市科技计划(23GXFW0040)

Interfacial bonding properties of Nb-Cu composite material fabricated by magnetron sputtering and electroplating thickening

Qi Ming¹, Sun Yuyan², Wang Pengfei³, Fang Yuan¹, An Zhen¹, Ding Xu¹

1. School of Materials Engineering, Xihang University, Xi'an Shaanxi 710077, China;
2. College of Materials Science and Engineering, Xi'an University of Architecture and Technology, Xi'an Shaanxi 710055, China;
3. Northwest Institute for Nonferrous Metal Research, Xi'an Shaanxi 710016, China

Received:2024-12-11 Revised:2025-03-21 Online:2025-06-25 Published:2025-07-08

摘要/Abstract

摘要： 由于Nb-Cu体系是一个典型的不混溶体系,在Nb-Cu间获得具有冶金强度的Nb-Cu结合界面仍然是一个难题。为了提高Nb-Cu 复合材料的界面结合强度,利用磁控溅射工艺,首先在Nb基体表面镀上一层稳定的Cu薄膜,再通过电镀的方法对Cu镀层进行增厚,再通过热处理进一步增大Nb-Cu复合材料的界面结合力。通过拉脱试验、能谱分析、表面平整度测定等检测手段研究了Nb-Cu界面的结合情况和扩散过程。结果发现,在溅射过程中,通过对Nb片进行预热可以增加原子活性,提高Cu镀层与Nb片间的元素扩散能力,同时还可以起到界面除气作用,相较于室温溅射,300 ℃溅射得到的Cu镀层与Nb片之间的结合效果更好。电镀工艺增厚的Cu镀层表面平整度高,与溅射Cu镀层结合紧密,可以降低制膜成本,提高增厚效率。300 ℃溅射时,经热压退火处理后,较普通退火工艺,可以得到更厚的Nb-Cu扩散层,并在Nb-Cu界面上形成更强的冶金结合界面。

关键词: Nb-Cu复合材料, 磁控溅射, 电镀, 热处理, 界面结合力

Abstract: Since the Nb-Cu system is a typical immiscible system, it is still a difficult problem to obtain a strong metallurgical interfacial bonding between Nb and Cu. In order to improve the interfacial bonding strength of Nb-Cu composites, a stable Cu metal film was prepared on the surface of Nb sheet substrate by magnetron sputtering, and then the Cu coating was thickened by electroplating. The interfacial bonding force of the Nb-Cu composites was further increased by heat treatment. The bonding state and diffusion process of the Nb-Cu interface were studied by means of pull-out test, EDS analysis and surface flatness measurement. The results show that preheating the Nb sheet during the sputtering process can increase the atomic activity, improve the diffusion ability between the Cu coating and Nb sheet, and also have a degassing effect. Compared with room temperature sputtering, the bonding effect between the Cu coating and Nb sheet obtained by 300 ℃ sputtering is better. The Cu coating thickened by electroplating process has a high surface flatness and is closely combined with the sputtered Cu coating, which can reduce the film production cost and improve the thickening efficiency. After hot pressing annealing treatment, the specimen sputtered at 300 ℃ can obtain a thicker Nb-Cu diffusion layer compared to that by ordinary annealing process, and form a stronger metallurgical bonding interface at the Nb-Cu interface.

Key words: Nb-Cu composite material, magnetron sputtering, electroplating, heat treatment, interfacial bonding

中图分类号:

TG156.21

齐铭, 孙昱艳, 王鹏飞, 方元, 安震, 丁旭. 磁控溅射-电镀增厚Nb-Cu复合材料的界面结合性能[J]. 金属热处理, 2025, 50(6): 289-293.

Qi Ming, Sun Yuyan, Wang Pengfei, Fang Yuan, An Zhen, Ding Xu. Interfacial bonding properties of Nb-Cu composite material fabricated by magnetron sputtering and electroplating thickening[J]. Heat Treatment of Metals, 2025, 50(6): 289-293.

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磁控溅射-电镀增厚Nb-Cu复合材料的界面结合性能

Interfacial bonding properties of Nb-Cu composite material fabricated by magnetron sputtering and electroplating thickening

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