关键词: 基片温度, Al薄膜, 退火, 晶粒, 附着力

Abstract: Al thin films were prepared on substrates with different temperatures by the vacuum evaporation method, and then vacuum annealing treatment was carried out on them. The effect of substrate temperature (25, 150, 200 ℃) on the microstructure and adhesion of the Al thin films were studied by means of X-ray diffractometer (XRD), scanning electron microscope (SEM), the peeling method, etc. The results show that when the substrate temperature is too high or too low, the growth of the Al thin films is uneven. When the substrate temperature is 150 ℃, the grain size of the Al thin film is uniform, indicating that this is an appropriate substrate temperature. Increasing the substrate temperature is beneficial to improve the adhesion of the thin film, but the improvement range is not large.

Key words: substrate temperature, Al film, annealing, grain, adhesion