金属热处理 ›› 2022, Vol. 47 ›› Issue (11): 261-265.DOI: 10.13251/j.issn.0254-6051.2022.11.044

• 表面工程 • 上一篇    下一篇

磁控溅射铜靶晶粒度对溅射性能与沉积性能的影响

王帅康1,2, 唐宾1, 鲍明东2, 展尚松1, 王铎3, 易晨曦3   

  1. 1.太原理工大学 材料科学与工程学院, 山西 太原 030024;
    2.宁波工程学院 材料与化学工程学院, 浙江 宁波 315211;
    3.长安大学 材料科学与工程学院, 陕西 西安 710061
  • 收稿日期:2022-06-14 修回日期:2022-09-15 出版日期:2022-11-25 发布日期:2023-01-04
  • 通讯作者: 唐宾,教授,博士,E-mail:tangbin@tyut.edu.cn
  • 作者简介:王帅康(1997—),男,硕士研究生,主要研究方向为磁控溅射靶材,E-mail:380318808@qq.com。
  • 基金资助:
    宁波市“科技创新2025”重大专项(2018B10066)

Effect of grain size of magnetron sputtering copper target on sputtering performance and deposition performance

Wang Shuaikang1,2, Tang Bin1, Bao Mingdong2, Zhan Shangsong1, Wang Duo3, Yi Chenxi3   

  1. 1. College of Material Science and Engineering, Taiyuan University of Technology, Taiyuan Shanxi 030024, China;
    2. School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo Zhejiang 315211, China;
    3. College of Material Science and Engineering, Chang'an University, Xi'an Shaanxi 710061, China
  • Received:2022-06-14 Revised:2022-09-15 Online:2022-11-25 Published:2023-01-04

摘要: 将平均晶粒度分别为30、70和150 μm的3块6N高纯纯铜方靶放在同一溅射系统中进行溅射,并检测和观察溅射后I-V特征曲线、质量损失以及所镀薄膜的表面形貌、厚度以及X射线衍射谱。结果表明,晶粒度作为靶材的一个重要参数指标,会影响靶材溅射后表面形貌和I-V特性曲线。当所镀薄膜较厚时,靶晶粒度并不会对靶的质量损失以及薄膜结晶情况产生太大的影响,但会对薄膜沉积率产生较大影响。

关键词: 磁控溅射, 铜靶, 靶晶粒度, 溅射性能, 沉积性能

Abstract: Three 6N high-purity copper square targets with average grain sizes of 30 μm, 70 μm and 150 μm respectively were placed in the same sputtering system for sputtering. The I-V characteristic curve, mass loss, and surface morphology, thickness and X-ray diffraction pattern of the coated film were detected and observed after sputtering. The results show that the grain size, as an important parameter of the target, affects the surface morphology and I-V characteristic curve of the target after sputtering. When the deposited film is thicker, the target grain size doesn't have much influence on mass loss of the target and the film crystallization, but the film deposition rate appears to be quite different.

Key words: magnetron sputtering, copper target, target grain size, sputtering performance, deposition performance

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