时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响
乔健, 刘政, 高惠明, 杨莉
Effect of aging time on microstructure and shear properties of Cu/In-Sn-2.5Ag/Cu solder joint
Qiao Jian, Liu Zheng, Gao Huiming, Yang Li
金属热处理
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2021, (9): 104
-107
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DOI: 10.13251/j.issn.0254-6051.2021.09.017