金属热处理 ›› 2025, Vol. 50 ›› Issue (5): 79-85.DOI: 10.13251/j.issn.0254-6051.2025.05.013

• 材料研究 • 上一篇    下一篇

4343/AZ31B/4343合金层合板界面金属间化合物生长动力学

刘洪杰1, 李辰1, 武鑫源1, 梁伟1,2   

  1. 1.太原理工大学 材料科学与工程学院, 山西 太原 030024;
    2.太原理工大学 分析测试中心, 山西 太原 030024
  • 收稿日期:2024-12-12 修回日期:2025-04-04 发布日期:2025-06-25
  • 通讯作者: 梁 伟,教授,博士,E-mail:liangwei@tyut.edu.cn
  • 作者简介:刘洪杰(2001—),男,硕士研究生,主要研究方向为镁铝层合板界面的微观结构,E-mail:2329101704@qq.com。
  • 基金资助:
    国家自然科学基金(52005362,U1810208,U1710254)

Growth kinetics of intermetallic compounds at interface of 4343/AZ31B/4343 alloy laminate

Liu Hongjie1, Li Chen1, Wu Xinyuan1, Liang Wei1,2   

  1. 1. School of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan Shanxi 030024, China;
    2. Analysis and Test Center, Taiyuan University of Technology, Taiyuan Shanxi 030024, China
  • Received:2024-12-12 Revised:2025-04-04 Published:2025-06-25

摘要: 针对4343/AZ31B/4343合金层合板扩散退火过程中产生金属间化合物的问题,以1060/AZ31B/1060合金层合板为对照组,对4343/AZ31B/4343合金层合板界面金属间化合物进行了生长动力学研究。对两种层合板分别进行了200~400 ℃下0.5~3.0 h的扩散退火,通过BSE表征和对镁铝界面进行EDS线扫描获得了不同扩散退火工艺下的金属间化合物层的厚度。对扩散动力学方程进行了推导,基于获得的金属间化合物厚度建立了两种层合板的金属间化合物的生长动力学模型。对比模型和实际结果可知,此模型可以较好地模拟实际扩散退火过程中金属间化合物的生长情况,为层合板的热处理提供了一定的理论依据。另外,在250 ℃×0.5 h的扩散退火试验中,4343/AZ31B/4343合金层合板未出现金属间化合物,而1060/AZ31B/1060合金层合板出现了厚度均匀的金属间化合物层,说明250 ℃时1060/AZ31B/1060合金层合板更容易析出金属间化合物。在更高温度的扩散退火过程中,两种层合板均产生了两种金属间化合物,Al侧的金属间化合物为Al3Mg2,Mg侧的为Mg17Al12

关键词: 镁铝合金层合板, 退火处理, 金属间化合物, 生长动力学

Abstract: In order to solve the problem of intermetallic compounds produced during diffusion annealing of 4343/AZ31B/4343 alloy laminate, the growth kinetics of intermetallic compounds at the interface of 4343/AZ31B/4343 alloy laminate was studied with 1060/AZ31B/1060 alloy laminate as the control group. Two kinds of laminates were diffusion annealed between 200-400 ℃ for 0.5-3.0 h, respectively. The thickness of intermetallic compound layers at different diffusion annealing temperatures and time was obtained through BSE characteristic and EDS line scanning of the Mg-Al interface. The diffusion kinetics equation was derived, and the growth kinetics models of intermetallic compounds for two kinds of laminates were established based on the obtained thickness of the intermetallic compounds. Comparing the model calculated values with the actual results, it can be seen that the model can simulate the growth of intermetallic compounds during the actual diffusion annealing process, and provide a theoretical basis for the heat treatment of laminates. In addition, in the annealing experiment at 250 ℃ for 0.5 h, there is no intermetallic compound in the 4343/AZ31B/4343 alloy laminate, while 1060/AZ31B/1060 alloy laminate shows a layer of intermetallic compounds with uniform thickness, showing that 1060/AZ31B/1060 alloy laminate is more prone to the precipitation of intermetallic compounds at 250 ℃. During the diffusion annealing process at higher temperatures, both laminates produce two types of intermetallic compounds, with Al3Mg2 on the Al side and Mg17Al12 on the Mg side.

Key words: magnesium aluminum alloy laminate, annealing treatment, intermetallic compounds, growth dynamics

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