Microstructure and properties of 7075 aluminum alloy hot compress bonding joint

doi:10.13251/j.issn.0254-6051.2020.02.009

Abstract

Abstract:

Hot compress bonding test of the 7075 aluminum alloy was carried out by a Gleeble-3500 thermal simulator. The joint interface microstructure under different temperatures and holding time was observed and analyzed by means of metallographic microscope and scanning electron microscope, and the tensile properties of the joint were tested. The results show that when the bonding temperature is 460 ℃ and the holding time is 24 h, no segregation of oxide at the interface is found by EDS analysis, and the mechanical properties are the best, the tensile strength reaches 444 MPa and the yield strength is 265 MPa.

Key words: hot compress bonding, deformation temperature, holding time, microstructure, mechanical properties

CLC Number:

TG453.9

Jiang Haiyang, Sun Mingyue, Wu Mingfang, Qiao Yanxin. Microstructure and properties of 7075 aluminum alloy hot compress bonding joint[J]. HTM, 2020, 45(2): 46-50.

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